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Copper Powder
Applications
Suitable for manufacturing rocket engine nozzle liners, integrated circuit heat dissipation substrates,induction coils, vacuum device electrodes, precision cooling channels in molds, etc.
Material characteristics
Loosse Density: ≥5 g/cm³
Tap Density: ≥5.2 g/cm³
Tensile Strength: ≥240 MPa
Yield strength: ≥165 MPa
Elongation/%：≥30%
（Heat-Treated，Room Temperature）
Powder morphology diagram
Application Examples
Applications
Suitable for manufacturing rocket engine combustion chambers, integrated circuit lead frames,induction coils,and continuous casting mold crystallizers.
Material characteristics
Loosse Density: ≥4.4 g/cm³
Tap Density: ≥5.2 g/cm³
Tensile Strength: ≥350 MPa
Yield strength: ≥250 MPa
Elongation/%：≥30%
（Heat-Treated，Room Temperature）
Powder morphology diagram
Application Examples
Applications
Suitable for manufacturing engine combustion chamber parts,heat exchangers,induction coils, etc.
Material characteristics
Loosse Density: ≥4.3 g/cm³
Tap Density: ≥5.0 g/cm³
Tensile Strength: ≥350 MPa
Yield strength: ≥180 MPa
Elongation/%：≥30%
（Heat-Treated，Room Temperature）
Powder morphology diagram
Applications
Used for manufacturing wear-resistant parts operating under high load, high sliding speed, and elevated temperatures, such as blades, gears and other parts in aerospace and mechanical industries.
Material characteristics
Loosse Density: ≥4.2 g/cm³
Tap Density: ≥4.5 g/cm³
Tensile Strength: ≥520 MPa
Yield strength: ≥400 MPa
Elongation/%：≥35%
（As-Deposited，Room Temperature）
Powder morphology diagram
